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Samsung has today announced that it is now mass producing its own ePoP (embedded package on package) memory for its high-end smartphones. The single memory package will consist of 3GB of LPDDR3 DRAM, 32GB of eMMC storage and a controller, combining all the essential memory components into a single package that can be stacked on top of the mobile processor without taking up any additional space.
Samsung's the first smartphone manufacturer to go down the ePoP route, as it previously used two-package eMCP (embedded multi-chip package) memory which was placed alongside the processor on the main circuit board. The new ePoP solution, on the other hand, saves a lot more space and will potentially allow for phone manufacturers to use that extra room for larger batteries.
To give you a better idea of how much room Samsung's saved, conventional PoP memory (which consists of a processor and DRAM) mesaures 15x15mm and a separate eMMC package measures 11.5x13mm. These take up 374.5 square millimeters in total. Samsung's ePoP memory, on the other hand, doesn't need any more space beyond the 15x15mm taken up by the main processor, so it only takes up 225 square millimeters. This is a saving of around 40%, and Samsung says its single-package configuration also meets the semiconductor package height ceiling of 1.4mm. According to Samsung, it can be easily customied as well so other OEMs will be able to use the ePoP package in a wide range of mobile devices, such as high-end tablets and other smartphones.
What's particularly interesting about this announcement, though, is that the 3GB specification announced today fits in exactly with the rumoured Exynos specification for the upcoming Galaxy S6, which Samsung is due to reveal on 1st March at MWC in Barcelona. According to the leaked specs, the Exynos model will have a 64-bit octa-core Exynos processor with an ARM Mali-T760 GPU, 3GB of RAM and 32GB of storage, so we wouldn't be surprised if the S6 was the first smartphone to use Samsung's new ePoP memory package.
“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” said Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics. “We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.”
